ABA-52563 3.5 ghz broadband silicon rfic amplifer data sheet description avagos ABA-52563 is an economical, easy-to-use, inter - nally 50-ohm matched silicon monolithic amplifer that ofers excellent gain and fat broadband response from dc to 3.5 ghz. packaged in an ultraminiature industry- standard sot-363 package, it requires half the board space of a sot-143 package. at 2 ghz, the ABA-52563 ofers a small-signal gain of 21.5 db, output p1db of 9.8 dbm and 19.9 dbm output third order intercept point. it is suitable for use as bufer ampli - fers for wideband applications. they are designed for low cost gain blocks in cellular applications, dbs tuners, lnb and other wireless communications systems. ABA-52563 is fabricated using avagos hp25 silicon bipolar process, which employs a double-difused single polysilicon process with self-aligned submicron emitter geometry. the process is capable of simultaneous high f t and high npn breakdown (25 ghz f t at 6v bvceo). the process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer inter - connect to achieve superior performance, high uniformity, and proven reliability. features ? operating frequency: dc ~ 3.5 ghz ? 21.5 db gain ? vswr < 2.0 throughout operating frequency ? 9.8 dbm output p1db ? 3.3 db noise fgure ? unconditionally stable ? single 5v supply (id = 35 ma) ? lead-free option available applications ? amplifer for cellular, cordless, special mobile radio, pcs, ism, wireless lan, dbs, tvro, and tv tuner applications surface mount package: sot-363/sc70 pin connections and package marking simplifed schematic note: top view. package marking provides orientation and identifcation. x is character to identify date code. vcc gnd 3 2hx input gnd 1 gnd 2 output & vcc vcc ground 1 ground 2 ground 3 rf input rf output & vcc
2 ABA-52563 absolute maximum ratings [1] symbol parameter units absolute max. v cc device voltage, rf output to ground (t = 25c) v +7 p in cw rf input power (vcc = 5v) dbm +20 p diss total power dissipation [3] w 0.4 t j junction temperature c 150 t stg storage temperature c -65 to 150 electrical specifcations t c = +25c, z o = 50 , p in = -30 dbm, v cc = 5v, freq = 2 ghz, unless stated otherwise. symbol parameter and test condition units min. typ. max. std dev. gp [1] power gain (|s 21 | 2 ) db 20 21.5 0.2 ? gp power gain flatness, f = 0.1 ~ 2.5 ghz db 0.5 f = 0.1 ~ 3.5 ghz 2.1 nf [1] noise figure db 3.3 4 0.12 p1db [1] output power at 1db gain compression dbm 9.8 0.15 oip3 [1] output third order intercept point dbm 19.9 0.18 vswr in [1] input vswr 1.2 vswr out [1] output vswr 1.4 icc [1] device current ma 35 43 0.5 td [1] group delay ps 150 notes: 1. measurements taken on 50 test board shown on figure 1. excess circuit losses had been de-embedded from actual measurements. standard deviation and typical data based on at least 500 parts sample size from 6 wafer lots. future wafers allocated to this product may have nominal values anywhere within the upper and lower spec limits. figure 1. ABA-52563 production test circuit. thermal resistance [2] (vcc = 5v): jc = 106c/w notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. thermal resistance measured using 150c liquid crystal measurement technique. 3. board (package belly) temperature, tb, is 25c. derate 3.5 mw/c for tb > 109c. rf output rf input vcc rfc c block c block c bypass 2hx
3 ABA-52563 typical performance t c = +25c, z o = 50 , v cc = 5v unless stated otherwise. figure 9. output ip3 vs. frequency and temperature. figure 8. output ip3 vs. frequency and voltage. figure 6. output power for 1 db gain compression vs. frequency and voltage. figure 5. noise figure vs. frequency and temperature. figure 4. noise figure vs. frequency and voltage. figure 3. gain vs. frequency and temperature. frequency (ghz) figure 2. gain vs. frequency and voltage. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) nf (db) 0 4.5 4 3.5 3 2.5 2 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) nf (db) 0 6 5 4 3 2 1 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) p1db (dbm) 0 14 12 10 8 6 4 2 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) p1db (dbm) 0 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) oip3 (dbm) 0 40 35 30 25 20 15 10 5 0 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) oip3 (dbm) 0 35 30 25 20 15 10 5 0 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c figure 10. input and output vswr vs. frequency. frequency (ghz) vswr 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 6 1 34 2 5 vswr in vwsr out figure 7. output power for 1 db gain compression vs. frequency and temperature.
4 ABA-52563 typical performance, continued t c = +25c, z o = 50 , v cc = 5v unless stated otherwise. figure 9. output ip3 vs. frequency and temperature. figure 8. output ip3 vs. frequency and voltage. figure 6. output power for 1 db gain compression vs. frequency and voltage. figure 5. noise figure vs. frequency and temperature. figure 4. noise figure vs. frequency and voltage. figure 3. gain vs. frequency and temperature. frequency (ghz) figure 2. gain vs. frequency and voltage. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) nf (db) 0 4.5 4 3.5 3 2.5 2 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) nf (db) 0 6 5 4 3 2 1 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) p1db (dbm) 0 14 12 10 8 6 4 2 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) p1db (dbm) 0 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c frequency (ghz) oip3 (dbm) 0 40 35 30 25 20 15 10 5 0 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) oip3 (dbm) 0 35 30 25 20 15 10 5 0 4 1 0.5 2 2.5 3 1.5 3.5 -40c +25c +85c figure 10. input and output vswr vs. frequency. frequency (ghz) vswr 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 6 1 34 2 5 vswr in vwsr out figure 7. output power for 1 db gain compression vs. frequency and temperature. figure 10. input and output vswr vs. frequency. frequency (ghz) vswr 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 6 1 34 2 5 vswr in vwsr out figure 11. supply current vs. voltage and temperature. icc (ma) 70 60 50 40 30 20 10 0 -40c +25c +85c voltage (v) 02 1 45 6 3 7
5 ABA-52563 typical scattering parameters t c = +25c, v cc = 5v, z o = 50 , unless stated otherwise freq s 11 s 11 s 21 s 21 s 21 s 12 s 12 s 12 s 22 s 22 k (ghz) mag. ang. db mag. ang. db mag. ang. mag. ang. factor 0.05 0.01 146.6 21.7 12.10 -2.6 -30.2 0.03 0.3 0.15 -2.4 1.492 0.10 0.00 134.0 21.7 12.11 -4.8 -30.5 0.03 -0.3 0.15 -5.1 1.528 0.20 0.00 -40.6 21.7 12.16 -9.6 -30.5 0.03 0.1 0.15 -9.6 1.523 0.30 0.01 -53.2 21.7 12.19 -14.5 -30.8 0.03 1.2 0.15 -13.0 1.560 0.40 0.02 -56.7 21.7 12.19 -19.5 -30.8 0.03 2.4 0.14 -15.7 1.560 0.50 0.03 -141.5 21.8 12.26 -24.8 -30.5 0.03 1.0 0.15 -15.7 1.516 0.60 0.03 -128.1 21.8 12.24 -29.8 -30.8 0.03 3.1 0.15 -17.6 1.557 0.70 0.04 -127.5 21.7 12.21 -34.9 -30.5 0.03 4.3 0.15 -20.3 1.520 0.80 0.04 -126.7 21.7 12.18 -39.8 -30.5 0.03 6.1 0.15 -22.5 1.523 0.90 0.05 -123.9 21.7 12.16 -44.7 -30.8 0.03 7.4 0.15 -24.2 1.563 1.00 0.05 -125.0 21.7 12.13 -49.7 -30.8 0.03 11.7 0.15 -26.4 1.566 1.20 0.05 -123.4 21.7 12.10 -59.6 -30.2 0.03 10.8 0.15 -29.4 1.490 1.40 0.06 -127.4 21.6 12.05 -69.4 -30.2 0.03 12.4 0.15 -32.4 1.491 1.60 0.06 -133.8 21.6 12.04 -79.6 -29.6 0.03 13.0 0.15 -35.3 1.424 1.80 0.06 -136.7 21.6 12.00 -89.8 -29.1 0.04 14.7 0.15 -37.8 1.370 2.00 0.07 -142.5 21.5 11.94 -100.4 -29.4 0.03 14.3 0.15 -38.3 1.402 2.20 0.07 -143.9 21.5 11.87 -111.2 -28.6 0.04 16.7 0.15 -37.8 1.326 2.40 0.08 -146.1 21.4 11.75 -121.9 -28.4 0.04 16.2 0.15 -37.3 1.309 2.60 0.09 -148.4 21.3 11.56 -133.2 -28.0 0.04 17.3 0.14 -36.9 1.279 2.80 0.09 -149.5 21.1 11.33 -144.5 -27.7 0.04 15.6 0.14 -36.4 1.273 3.00 0.10 -152.7 20.8 10.95 -156.1 -27.3 0.04 15.8 0.13 -35.9 1.263 3.20 0.10 -158.7 20.4 10.51 -167.5 -27.1 0.04 15.6 0.13 -35.4 1.275 3.40 0.11 -163.2 20.0 9.97 -178.7 -27.3 0.04 15.5 0.13 -34.9 1.338 3.50 0.11 -167.6 19.7 9.67 175.9 -26.6 0.05 16.0 0.13 -34.6 1.285 4.00 0.12 165.9 18.3 8.25 150.6 -.26.2 0.05 12.0 0.13 -33.4 1.386 4.50 0.16 138.3 16.9 6.98 126.3 -25.5 0.05 12.7 0.14 -37.1 1.462 5.00 0.19 122.8 15.1 5.71 105.0 -24.7 0.06 9.5 0.12 -48.4 1.585 5.50 0.25 112.3 13.7 4.85 86.7 -23.5 0.07 6.0 0.12 -63.0 1.565 6.00 0.30 99.3 12.3 4.14 70.4 -23.1 0.07 1.0 0.11 -83.5 1.680
6 device models refer to avagos web site: www.avago.com/view/rf ordering information part number devices per container container ABA-52563-tr1 3000 7" reel ABA-52563-tr2 10000 13" reel ABA-52563-blk 100 antistatic bag ABA-52563-tr1g 3000 7" reel ABA-52563-tr2g 10000 13" reel ABA-52563-blkg 100 antistatic bag note: for lead-free option,the part number will have the character g at the end. package dimensions outline 63 (sot-363/sc-70) recommended pcb pad layout for avago's sc70 6l/sot-363 products 0.026 0.079 0.018 0.039 dimensions in inches. e he d e a1 b a a2 q1 l c dimensions (mm) min. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.15 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.30 0.20 0.30 symbol e d he a a2 a1 q1 e b c l notes: 1. all dimensions are in mm. 2. dimensions are inclusive of plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all specifcations comply to eiaj sc70. 5. die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. package surface to be mirror fnish. 0.650 bcs e he d e a1 b a a2 q1 l c dimensions (mm) min. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.15 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.30 0.20 0.30 symbol e d he a a2 a1 q1 e b c l notes: 1. all dimensions are in mm. 2. dimensions are inclusive of plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all specifcations comply to eiaj sc70. 5. die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. package surface to be mirror fnish. 0.650 bcs
7 device orientation tape dimensions and product orientation for outline 63 p p 0 p 2 f w c d 1 d e a 0 10 max. t 1 (carrier tape thickness) t t (cover tape thickness) 10 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 0.10 4.00 0.10 1.75 0.10 0.061 + 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 + 0.30 - 0.10 0.254 0.02 0.315 + 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.40 0.10 0.062 0.001 0.205 + 0.004 0.0025 0.0004 cover tape user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view (package marking example orientation shown.) 2h 2h 2h 2h
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. obsoletes 5989-1971en av02-1785en - february 11, 2009
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